从设计角度看，EMIB-T不再局限于简单的2.5D互连，而是向3D封装技术Foveros靠拢，使得在更大芯片尺寸下实现高密度集成成为可能，为未来异构计算平台提供灵活封装架构。
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news.flinders.edu.au
Игорь Комаров и его девушка, блогер Ева Мишалова
Launch had been planned for early February, but it was delayed to repair a hydrogen leak and, more recently, to give engineers time to fix a helium pressurization problem in the rocket's upper stage. Launch is now on hold until at least April 1.